OSP and immersion gold are two common technologies in PCB surface treatment, the purpose of which is to prevent copper surface oxidation and help soldering. So what's the difference between the two?

1. Different technology principles

The OSP technology is an organic coating method. The technology principle is to chemically generate an organic film on the copper、

urface of the PCB to protect the copper surface of the PCB from oxidation or corrosion in a humid environment. The principle of the immersion gold technology is to use the chemical deposition method to generate a layer of nickel-gold plating on the copper surface of the PCB soldering through a redox reaction to prevent the copper surface from being oxidized.

2. Different technology process

The technology process of OSP and immersion gold is different. The process control of the OSP technology is relatively simple, while the process control of the immersion gold technology is relatively complicated. In terms of cost, because more gold elements are used in the immersion gold process, the cost will be relatively high. The materials used in the OSP technology are mainly resins, so the cost is low.

3. Advantages and disadvantages are different

The advantages of immersion gold technology: good surface flatness, excellent electrical properties, high solderability, and long storage time;

Disadvantage: higher cost.

Advantages of OSP technology: low cost, smooth surface, good weldability;

Disadvantages: It is not easy to save, and the number of times it can be welded is less.